CSP LED Chip
(7)
1.0*0.5mm Wafer Packaging 1005 CSP Chip LED Chip 1800-6500K For Smartwatch Automotive Interior Lighting
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
High Light:Customized CSP LED Chip, Mini CSP LED Chip, 1800K White LED Chip
Features: The latest generation of LED products utilizes CSP packaging technology. Manufactured with flip chip technology and fluorescent film. Offers high resistance to heat, efficient heat dissipation, and minimal light decay. Features flexible arrangement and combination options within a compact ... View More
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0.7x0.5x0.3mm 0705 CSP LED Wafer Level Chip LED Sealing without Packaging for Optical Indicators
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
Features: The latest generation of LED products utilizes CSP chip-level packaging technology. Manufactured using flip chip technology and fluorescent film. Features excellent resistance to high temperatures, superior heat dissipation, and minimal light decay. Can be arranged and combined freely on a... View More
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0.7x0.4x0.3mm 0704 CSP Chip 1800-6500K Good Heat Dissipation LED Chip For Signal Luminaire
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, wit... View More
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1.3x1.3x0.3mm 1313 Top and 4-side Emitting 700mA CSP LED Chip for Backlighting and Smartwear
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
Features: CSP chip-level packaging technology for next-generation LED solutions. Manufactured with flip-chip technology and phosphor film. Excellent high-temperature resistance, superior thermal management, and minimal light degradation. Flexible arrangement and combination on a compact light-emitti... View More
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1.0x1.0x0.3mm 1010 300mA Fluorescent Film CSP Chip LED For Symbol Luminaire
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, with ... View More
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0.9x0.5x0.4mm 0905 Excellent Color Consistency CSP LED For Lamp Tube
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, with ... View More
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0.8x0.5x0.4mm 0805 Flip Chip Framed Auxiliary Electrode CSP LED For Outdoor Displays
Price: Negotiable
MOQ: 200K
Delivery Time: 7-10 workdays
Features: 1) CSP chip level packaging technology for the new generation of LED products. 2) Made using flip chip and fluorescent film. 3) High temperature resistance, good heat dissipation, and less light decay. 4) It can be arranged and combined arbitrarily within a small luminescent surface, with ... View More
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