China semiconductor die and substrate
suppliers
BT semiconductor IC packaging substrate manufacture
Price: US 85-120 each square meter
MOQ: 10 square meter
Delivery Time: 7-10 working days
Brand: Horexs
Silicon Nitride Si3n4 Ceramic Thermal Shock Resistance For Semiconductor Die Casting Machine
Price: us$1~us$1000/P
MOQ: 10p
Delivery Time: negotiable
Brand: wuxi special ceramic
2-6 Inch Semiconductor Substrate LiNbO3 Single Crystal Substrate Wafer
Price: by case
MOQ: 25pcs
Delivery Time: 2-4weeks
Brand: zmkj
2" InSb-Te EPI Substrates Narrow Band Semiconductor Substrates Hall Components
Price: Negotiation
MOQ: 25pcs
Delivery Time: In 30 days
Brand: ZMSH
High Precision Semiconductor Packaging Equipment led Die Bonder die Bonding Machine Die Attach Die Bonder
Price: Negotiable
MOQ: 1 set/sets
Delivery Time: 5-8 days
Brand: WZ
IN Fineon IRLML0060TRPBF IC Electronic Circuits QFJ Thin Substrate Of Semiconductor Material
Price: $2.68/pieces 10-99 pieces
MOQ: 10 pieces
Delivery Time: Negotiable
Mo MoCu Molybdenum Products Wafer Substrate For Semiconductor Industry
Price: 30~150USD/kg
MOQ: 1kg
Delivery Time: 25 work days
Brand: JINXING
6 Inch 0.5mm Borofloat 33 Glass Substrate For Semiconductor Industry And MEMS
Price: Negotiable
MOQ: 5 pcs
Delivery Time: 1-4 weeks
Brand: BonTek
Semiconductor Single Crystal Gallium Oxide Substrate UID Doping
Price: Negotiable
MOQ: Negotiable
Delivery Time: 3-4 week days
Brand: GaNova
Polished Trim And Form Dies Semiconductor Package Dies Customizable
Price: Negotiable
MOQ: 1 set
Delivery Time: 40 days
Brand: TJIN
0.64MM Thickness Die Cut Adhesive Tape Custom Bonds Low Surface Energy Substrates 3m vhb tapes
Price: USD 0.01~0.1 per piece
MOQ: 100 pieces
Delivery Time: 3~10 work days
Brand: 3M / PUFENG
FPC PCB Punching Machine FR4 Substrate Cutting With Cutomized Die Tooling
Price: USD1-10000/set
MOQ: 1 set
Delivery Time: 7-15 days
Brand: Winsamrt
Wafer Bar Bare Die Tray Packaging Electronics For Semiconductor Industry
Price: $0.35~$0.85(Prices are determined according to different incoterms and quantities）
MOQ: 1000
Delivery Time: 5~8 working days
Brand: Hiner-pack
ISO9001 CNC Milling Edge Machine For Semiconductor Aluminum Alloy Die Casting Parts
Price: Negotiable
MOQ: 1
Delivery Time: 10-15 working days
Brand: JIAYUYI
KDC/DC Series Precision Dispensing Controller VCM SEMICONDUCTOR CHIP DIE BOND MEMS SOLDER PASTE DISPENSING Lens Industry
Price: $1-$10000
MOQ: 1
Delivery Time: 5-60 days
Brand: MingSeal
AOI Semiconductor wire bonding inspection for die bonding machine and track design
Price: Negotiable
MOQ: 1
Delivery Time: 20 work days
Brand: MENTO
Semiconductor devices Packages Soldering with Substrates Vacuum Reflow Oven with Formic Acid Atmosphere
Price: Negotiable
MOQ: 1.0 Sets
Delivery Time: Negotiable
Brand: TORCH
SMD Production Line Semiconductor Wafer Chip Cleaning Machine For Cleaning Wafers And Substrates Post Carving Automatic Wafer Jet Cleaning Machine
Price: Negotiable
MOQ: 1 Set
Delivery Time: Negotiable
Brand: D-WIN
Vacuum Industry Electronics and Micron Precision Winding Polishing Machine for Wafer Silicone Wafer for Semiconductor and Substrate Sensor
Price: $0.06(>=100 pieces)
MOQ: 100.0 pieces
Delivery Time: Negotiable
Brand: Rongxin
MGC Packaging Substrate For IC OR Semiconductor
Price: Negotiable
MOQ: 1 square meter
Delivery Time: Negotiable
Brand: N/A, No brand