310*320mm Panel Size Panel Level QFN Low Electrical Resistance
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Description: 310*320mm panel size, Chip size: 0.76*0.61mm; Package size: 2.76*1.97mm; Package thickness: 360um, Application: Power management, Process introduction: The coming wafer is bumped with Cu post (e.g., 50 micro meters), after thining and dicing of wafer, chips with bump are picked and plac... View More
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Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... View More
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0.5mm Thickness Panel Level Packaging Panel Level BGA/CSP For Power Adapter
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Brand: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process introduction: After the chip is picked and placed onto the temporary carrier board, the packaging process is carried out by compression molding, plasma c... View More
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Panel Level Packaging Panel Level SiP Used In Various Industries
Price: Negotiable
MOQ: Negotiable
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: 310*320mm panel size; Advantage:Small SiP package size,such as 6*6mm/7.5*7.5mm;low power consumption;multi-chip packages, high assembly efficiency. Technical capability: different functional dies are assembled in one system,for example, MCU, Bluetooth and some passive chips are assemble... View More
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310*320mm Panel Size Thin MOS Chip Silicon Low Power Consumption
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Multi-chip MOSFET 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Applications: Military applications, new energy vehicles, Power adapter, power amplifier, automotive electronics, etc. Competitive Advantage: 1... View More
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LED Chip Silicon LED Constant Current Driver Chip 0.4mm*0.555mm*0.20mm
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps. Specifications: Chip size 0.... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Resistance Chip（Silicon）
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Chip size: 0.76*0.61; 1.43 * 1.06； Package size: 2.76*1.97; 2.58 * 2.92； Package thickness: 360um； Process introduction: After the chip is reconstructed to the temporary carrier board, the pick and placement is performed and later plastic compressive molding, followed by grinding, laser... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP)IC Chip（Silicon）
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Panel size:310*320mm; Package size: 12*18*0.9mm; Package thickness: 0.9mm; Brief introduction to the process: After the temporary carrier board is attached, plastic sealing and chip reconstruction are done, the first layer of RDL is made, followed by etching +ABF pressing + laser drilli... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) GaN Product
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
310*320mm Panel size; DIE1 size:1.89*1.64mm; DIE2 size:0.926*0.626mm; Package size:6*7mm; Package thickness: 0.42mm; Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the ba... View More
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... View More
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... View More
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Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Radio Frequency (RF)
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Panel size:310*320mm Package size: 7*6mm Package thickness: 0.75mm Process flow: The Face down packaging method is adopted for mounting, plastic sealing and grinding, the first layer of process is ABF pressing, and then etching and punching on the back of the plastic sealing material, t... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) MEMS Microphone Package
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: Plating uniformity: ≤10%; Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.78mm; Process type: FOPLP (310X320mm); Applications: Mobile phone, Bluetooth headset,MEMS, wearable electronics. Specifications: Package size: 3*2mm; Package thickness: 0.26mm; Chip size: 0.96*0.... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) CPO/Mini/Micro LED
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: LED constant current driver chip; Chip size 0.4mm*0.555mm*0.20mm; Panel size 310*320mm; Package size 122mm*50mm; Process: Patch on the temporary carrier board, press EMC film, etching, then drill the hole, do electrode-plating. Applications: Mini-LED, lamps Specifications: Chip size 0.4... View More
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310*320mm Fan-Out Panel Level Packaging (FOPLP) Power Package
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: 310*320mm panel size; Package size: 2.0*2.0mm; Package thickness: 0.5mm; Chip size: 1.0*1.6mm; Process type: FOPLP (Face Up); Process flow: face up encapsulation method is adopted. After a single patch, bump, plastic sealing and grinding (exposing the ball), then punch holes and electro... View More
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high aspect ratio TGV Foundary Capabilities for semiconductor packaging
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX -TGV
Description: As shown in the following table, the glass core substrate with 510mmX515mm size can be manufactured inside the manufacturing line. The glass thickness is varied from 0.3mm to 1.5mm (some can be extended to 5mm thick). The aspect ratio (diameter/ thickness of glass)can be varied from 1:1... View More
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High Efficiency Though Hole/Blind Hole On Glass 35um For GPU/CPU/AI Chips
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: As shown below photo, the blind or through holes can be made with angle controlling, the laser and acid methodology can be combined together to make customer specific holes. The glass can be coming from different suppliers, e.g., AF32/BF33 (Schott), EAGLE XG or AGC, etc. The shape of ho... View More
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High Efficient Glass Substrate Panel Size 510*515mm PVD 300mm-600mm
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: The panel level PVD can be performed at both sides of the panel simultaneously. It is high efficient and time saving process. The panel sizes are varied within 300mm-600mm. Ti/Cu can be performed as the seed layers. The thickness is controlled with 0.1-2 micro meters. The uniformity in ... View More
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Glass Substrate Technology-Plating Double Side Stable And Easily Maintain
Price: Negotiable
MOQ: 10 panel
Delivery Time: 1 month
Brand: FZX -plating
Description: The panel plating machine is used for plating, Plating uniformity can achieve below 10%,High aspect ratio of glass through-hole plating can be performed, AR < 10 : 1 1,All pass padding Dia .: 100 μm Cu thick .: 10 μm Glass thick .: 600μm 2,Through hole plating Dia .: 50 μm Cu thick .... View More
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