Panel Level Packaging Product Structure
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Panel Level Packaging Face Down-EWLB High Heat Dissipation High Reliability
Price: Negotiable
MOQ: Negotiable
Delivery Time: Negotiable
Description: 1,Compared with traditional packaging methods (e.g., wire bond and substrate), it has the obvious characteristics of high heat dissipation (thick Cu), high reliability (short connection and strong surface adhesion), high voltage and high current (thick Cu). 2,It can be used in various a... View More
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wafer Bump
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fan-Out Panel Level Packaging
Description: Die with bump of MOS&MOS-Like package can be picked and placed onto the temporary carrier; C mold is performed after above die placement with face-up methodology. The mold grinding, PVD and plating will be made for RDL. The TMV will be made for the top/bot layer connection. The surf... View More
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Fan-Out Panel Level Packaging (FOPLP)-Product Structure(Face Up)-Wire Bond Ball
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX Fanout Process and Product
Description: As shown in above photo, compared with traditional packaging methods, the wire bond ball (copper or gold) can be made from wire bond process, it is similar to bump of chip, therefore, it has higher integration, high reliability, and low cost; through the FOPLP process , multiple MCU and... View More
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Fan-Out Panel Level Packaging (FOPLP) Product Structure Embedded Package
Price: Negotiable
MOQ: 3000pcs
Delivery Time: 1 month
Brand: FZX
Description: 1,Compared with traditional packaging methods, this advanced packaging replaces wire bond and substrate, therefore, it has demonstrated the characteristic of higher integration, high reliability, and low cost ; 2,While maintaining the original foot position design, it is much thinner an... View More
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